People developing Data Center chips benefit from custom ESD protection solutions. The main bottleneck is the speed at which data can be transferred. To enable high-speed communication designers use thin-oxide transistors and low voltage signal protocols at the SerDes/PCIe interface.
In the past the short distance (between racks) connections relied on electrical communication while the long distance, between data centers, uses optical communication. These days even for the short distance optical communication is used.