ESD protection approaches

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3 approaches to handle EOS ‘requirements’

EOS, or Electrical Overstress, is any electrical stress that exceeds any of the specified absolute maximum ratings (AMR) of a product. It is important to discuss because many products are damaged this way. This article includes case studies and 3 approaches to handle those requests.
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Optimized on-chip ESD protection to enable high-speed Ethernet in cars.

In the past most Electronic Control Units (ECU) used CAN and LIN interfaces to connect to sensors, actuators and each other. However, the newest applications need (much) faster communication options. Gigabit automotive ethernet is pushed by many in the industry as the perfect solution. With its local ESD clamp approach, Sofics provides the best solution[...]
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Selecting custom ESD IP for your next IC

Fabless semiconductor companies usually use third-party IP blocks when developing ICs. An important IP is on-chip ESD protection. Caution must be exercised in choosing the right ESD IP to avoid patent infringement and inefficient ESD clamps. Thomas Ako made a presentation about the IP selection process on the 2021 IP-SOC event in Grenoble in December 2021.
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Optimized ESD protection based on Silicon Controlled Rectifiers (SCR), verified on Samsung Foundry 4nm and 8nm FinFET processes

Engineers developing semiconductor devices in the most advanced FinFET technology need improved ESD protection solutions. We demonstrate ESD protection solutions based on proprietary Silicon Controlled Rectifiers verified on the Samsung Foundry 8nm and 4nm FinFET process.
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ESD protection solutions for space applications

Space applications require custom I/O and ESD protection solutions. Sofics proprietary ESD technology has been used for a number of aerospace projects. Our engineers delivered custom rad-hard ESD devices for TSMC 28nm, 65nm and 130nm CMOS technologies. The cells enable low power design in an extended temperature range. Different concepts are used to enable cold-spare[...]
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Optimized Local I/O ESD Protection in FinFET Technology for 2.5D and 3D hybrid integration

Semiconductor companies using 2.5D and 3D hybrid integration need to consider Electrostatic Discharge (ESD) protection early in the design, even for die-2-die interfaces that remain inside the package. There are several challenges but also opportunities. The use of a local ESD protection clamp at the TSV offers more robustness, higher performance, more flexibility, all in[...]
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ESD clamps for high voltage, BCD processes

Some applications really need high voltage interfaces and circuits. Think about power management and power conversion chips, automotive electronics for engine control, LCD or OLED display driver chips, motor driver electronics and industrial applications. These high voltage applications require other ESD protection clamps compared to the clamps used for protection of low voltage circuits. Sofics[...]
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