On-chip ESD protection for high voltage and BCD

  • upto 100V supplies.
  • Tailored for demanding appliations

  • Automotive, Industrial, Medical, ….
  • Proven in 10 different BCD and HV processes
  • More than xxx patent families and xxx patents worldwide
  • Quick and easy portable solutions available
  • More than 10 customers

  • Low Design Cost

  • Pre-developed solutions
  • Customized and optimized per application
  • Low Mask Cost

  • Compatible with standard process flow
  • No additional masks:
  • only us well types required for circuitry
  • Low Wafer Cost

  • Small silicon area

  • Time-to-market

  • First Time Right
  • Pre-Developed
  • Easy access to support engineers
  • Risk Reduction

  • Proven Solutions
  • Silicon Proven
  • Product Proven
  • Clean IP Portfolio
  • Product proven in > 10 processes

  • Any ESD model
    Any specification level

  • Human Body Model (HBM)
  • Machine Model (MM)
  • Charge Device Model (CDM)
  • System Level ESD
    (IEC61000-4-2 or ISO 10605)
  • Hand Metal Model (HMM)

  • All disturbances

  • Static Latch up
    (JEDEC78, ...)
  • Transient Latch up
  • Electrical Overstress (EOS)
    (IEC 61000-4-5,... ), ...
  • Automotive pulses
    (ISO 7637-2, ISO7637-3, ... )
  • EMC (EMI)
    (IEC 62312, ISO 16750.. )...

  • Low Capacitance
    for high frequency applications

  • Optimize junction capacitance
    and metal capacitance
  • optimize for Common Mode Rejection Ratio
    (CMRR)
  • Low Leakage
    for low power applications

  • Minimize static leakage
  • Compatible with any start up sequence

  • Overvoltage designs

  • No diode to supply allowed
  • Hot Swap

  • Allow plug in during power up
  • Undervoltage designs

  • Including Miswiring conditions
  • Low noise applications

  • Complex power bus architectures
  • Complex ground bus architectures