Five ways Sofics ESD solutions cut your IC costs

Generic ESD/EOS solutions provide generic protection. With Sofics solutions your IC designs benefit from state-of-the-art protection, plus assurance of maximum performance, at a lower total cost. Here’s how we do it.

No custom ESD/EOS development costs

Sofics has an extensive library of ready-to-use ESD solutions, fully tested, analyzed, qualified, and product-proven. They port easily with minimal adaptation, allowing your designs to be more cost-efficient. You’ll save time and reduce cost without giving up quality, performance or innovation.

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Lower design cost

You get full design data for your Sofics ESD/EOS solution, complete with datasheet, plug-and-play guidelines, and LVS schematics. Implement it yourself (with or without our help) to reduce costs, or have us do it for you to achieve fastest turnaround and make optimum use of your internal resources.

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Reduced manufacturing costs

With smaller Sofics solutions your ICs yield more chips per wafer, for a lower cost per chip. Their reduced size can help ICs fit into smaller packages. Our technology eliminates the need for ESD implants and extra masks for both captive foundries and fabless customers, saving mask and recurring processing costs. It works in standard processes to keep your manufacturing cost minimal.

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No re-spins

Sofics ESD/EOS solutions work right from the start. There’s no time or money wasted on failure analysis and re-engineering, and no expensive re-spins. As a bonus, you get to market faster, without costly delays.

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Reduced liability

Field failures and patent disputes can keep your IC from market success. Sofics ESD/EOS solutions help control your exposure to such liabilities. Our solutions have proven reliable in over 1,500 high-volume ICs, and our market-leading IP is vetted for originality and absence of infringement.

Visit these pages to explore areas where Sofics solves ESD/EOS problems while controlling costs.

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