For over 15 years, in more than 1,500 commercial ICs, Sofics ESD solutions have delivered stable and predictable ESD clamping behavior across multiple applications, process corners, foundries, and process generations. Customer testimonials reflect their success in a broad spectrum of process parameters.
TakeCharge®, for example, has been ported with consistent ease and performance across 9 generations of CMOS process technologies, from 0.5um down to 28nm. You can review the data on the portability of this and other Sofics ESD/EOS solutions by clicking here, or contact us.
PowerQubic®, our technology for high-voltage interfaces, is similarly adaptable. It is silicon verified and licensed by TSMC for their 0.25um BCD 12V/24V/40V technology. For solutions in TSMC processes currently under development (including 0.18um and 60V), please contact us by clicking here.
Sofics ESD/EOS solutions have been proven in different technology nodes at all major foundries (e.g. TMSC, UMC, Tower-Jazz, SMIC, and GSMC). Simply click here to see if there is an off-the-shelf Sofics ESD cell for your target foundry process.
If your chosen process does not appear, we can usually port our technology to it very quickly. Sofics solutions have been ported to different foundries and process nodes in two weeks time.
If your company is an integrated device manufacturer (IDM) with its own fab, we can implement Sofics solutions in your process. Sofics has successfully customized and ported its ESD/EOS solutions to IDM processes in more than 35 technology transfer projects. Most of these projects involved the transfer of know-how and trade secrets to enable our customers to port the solutions to their other process nodes.
Sofics has ongoing partnerships with a growing list of major foundries. Here are some highlights.
Sofics ESD/EOS solutions have been ported to other foundries as well, including Global Foundries, GSMC, SMIC, Fujitsu, Epson… For a complete overview of available foundry process nodes, click here.