• On-Chip ESD protection
    for high voltage and BCD

  • Upto 100V supplies

  • Tailored for demanding applications

  • Automotive, industrial, medical…

  • Proven in 10 different BCD and HV processes

  • Quick and easy portable solutions available


  • Check our list of qualified technologies

  • Low design cost

  • Pre-developed solutions

  • Customized and optimized per application


  • Low mask cost

  • Compatible with standard process flow

  • No additional masks:

  • Only use well types required for circuitry

  • Low wafer cost

  • Small silicon area

  • Time-to-market

  • First time right

  • Pre-developed

  • Easy access to support engineers

  • Risk reduction

  • Proven solutions

  • Silicon proven

  • Product proven in 10 processes

  • Clean IP portfolio


  • Any ESD model
    Any specification level

  • Human Body Model (HBM)

  • Machine Model (MM)

  • Charge Device Model (CDM)

  • System Level ESD
    (IEC61000-4-2 or ISO 10605)

  • Hand Metal Model (HMM)

  • Any disturbance
    Any specification level

  • ElectroStatic Discharge (ESD):
    HBM, MM, CDM, system level, ...

  • Static & transient latch up

  • Electrical OverStress (EOS): IEC 61000-4-5,...

  • Automotive pulses: ISO 7637-2 & -3, ...

  • EMC (EMI): IEC 62312, ISO 16750...

  • Low power applications

  • Minimize static leakage

  • High frequency/speed applications

  • Minimize junction and metal capacitance

  • Low noise applications

  • Complex ground/power bus architectures

  • Compatible with any start up sequence

  • Overvoltage designs

  • No diode to supply allowed

  • Hot swap

  • Allow plug in during power up

  • Undervoltage designs

  • Including miswiring conditions