“Reuse of TakeCharge IP in Toshiba’s 180nm to 65nm ASIC products has consistently resulted in robust Charged Device Model (CDM), Human Body Model (HBM) and Machine Model (MM) performance.”
“Sofics is excited and honored to cooperate with TSMC. Our mission is to empower customers with advanced solutions and tools so they can independently perform successful ESD design, getting it right the first time, every time, regardless of the complexity of the process, application or innovation.”
“Sofics combines IP in an advanced design flow with calculation and integration tools, and customized services. They complement the diverse Design Services offered by our portfolio of DCA partners,”
“Our alliance with UMC means that customers will achieve shorter design cycles for proven specialty solutions optimized with advanced ESD protection. Together, Sarnoff and UMC can better meet the specialized needs of our customers by bringing cost efficient, higher-quality solutions to market much faster.”
“With the addition of TakeCharge on-chip ESD protection design solutions to the UMC IP Alliance Program, UMC customers will have easy access to superior ESD design solutions from an industry wide recognized leader in its field”
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